The Integrated Circuits and Microsystems Research Group at the University of Arizona conducts research in the general area of analog and mixed-signal integrated circuits, high-speed serial link circuits and systems, and RF and microwave circuits and systems for wireless and wireline communications, computing, imaging, sensor, and biomedical applications. Our research's primary goal is to enhance circuit performances by boosting circuit speed, reducing power consumption and enhancing circuit reliability. Specific current research topics include digital PLL and CDR, backplane equalization, high-speed electrical and optical serial-links, clocking and synchronization circuits (PLL, DLL and CDR), reconfigurable RF transceivers for wireless cellular and base-station applications, high-performance analog-to-digital and digital-to-analog converters, and circuits and systems for memory, ultrasonic medical imaging, radiation and extreme temperature environment applications.

List of sponsored research projects:

• MRI Consortium: Development of Wireless Networking Testbed and Emulator (WiNeTestEr)
  Sponsor: National Science Foundation
• Collaborative Research: MEMS-Switched Acoustic Delay-Line Microsystems for Advanced Ultrasonic Imaging
  Sponsor: National Science Foundation
• Collaborative Research: A Novel Wireless Power Transmission Architecture for Devices Implanted in Human Bodies
  Sponsor: National Science Foundation
• MRI Consortium: Acquisition of Instrumentation for High-Speed/Rad-Hard Optical Electronics Design and Testing
  Sponsor: National Science Foundation
• Digitally Assisted Multi-Standard RF Receiver Front-End and Continuous-Time Sigma-Delta A/D Converter for Wireless Base Stations
  Sponsor: LSI Corporation
• Low-Jitter Wideband Digital PLL and 16 Gbps Digital CDR and SerDes
  Sponsor: Texas Instruments and Semiconductor Research Corporation
• Probing Effect of Defects on Ferroelectricity in Ferroelectric Thin Films
  Sponsor: Semiconductor Research Corporation
• Low-Jitter PVT-Compensated Wideband LC-PLL for Multi-Protocol Serial Links
  Sponsor: Huawei Technologies
  
• Low-Power and High-Speed SerDes and Clock and Data Recovery Circuits for Harsh Environments
  Sponsor: Industry Funding
  
• Mixed-Signal and RF Integrated Circuits and a Reconfigurable RF Transceiver for Harsh Environments
  Sponsor: Industry Funding
  
• Noncontact Ultrasonic Battery Charging System for Implanted Medical Devices
  Sponsor: SMU School of Engineering Interdisciplinary Seed Fund
  
• Design and Testing of Radiation-Tolerant Analog-to-Digital and Digital-to-Analog Converters
  Sponsor: Industry Funding
  
• High-Temperature Analog-to-Digital Converter Design
  Sponsor: Industry Funding