ECE 654 Spring
2000 - Syllabus IC
702-E
Electronic
Packaging Design
Instructor: Olgierd A. Palusinski
Department of Electrical and Computer Engineering
University of Arizona, Tucson
Tel: (520) 621-4928
FAX: (520) 621-8076
E-mail: palusinski@ece.arizona.edu
Office Hours: TBA
Class: TBA
Prerequisites: Graduate standing in engineering or science. ECE 554 (NTU: IC 701-E) is
recommended but not required. ECE 554 can be taken concurrently.
Textbook: None. Class notes will be available to students and readings from
the reference texts will be suggested.
Reference texts:
1. Dally, J. W., 1990, Packaging of Electronic Systems, McGraw, N. Yl
2. Pecht, M., 1991, Handbook of Electronic Packaging Design, Marcel Dekker, N. Y.
3. Tummala, R. R. and E. J. Rymaszewski (Eds.), 1997, Microelectronics Packaging Handbook, Van Nostrand Reinhold, N. Y.
4. Shackelford, J. F., 1992, Introduction to Materials Sciences for Engineers, McMillan, N. Y.
5. Capillo, C., 1990, Surface Mount Technology - Materials, Processes, and Equipment, McGraw, N. Y.
6. Prasad, R. P., 1989, Surface Mount Technology - Principles and Practice, Van Nostrand Reinhold, N. Y.
Course Objectives:
A student completing this course will be familiar with the fundamentals for analysis and design of packages for integrated circuit applications. This course will provide analytical tools for the first order solutions to several packaging design problems. The course crosses traditional boundaries between engineering specialties and involves electrical engineering, materials sciences, and mechanical engineering. This is a rapidly developing area of engineering, with a very few universities offering packaging courses. Consequently, packaging experts are in a short supply and industry demand is high.
Course Description:
This course includes the analysis and design of chip- and board-level packages and interconnections for integrated circuit applications. Analysis/design problems have been selected to cover spectrum of module configurations, performance characteristics, manufacturing technologies, and costs. Electrical, thermal, and mechanical considerations are presented with their relation to global performance. Optional term paper allows students to get involved in solving, simplified, but realistic design problems inspired by an industrial experience. Research problems will also be considered as term paper topics.
Homework: Assigned but not collected
Examinations: See grading. Projects: See grading
Grading:
- Term paper option
Final examination: 30%
Seminar participation 20%
Term Paper: 50%
A topic for the term paper may be selected from the list provided (see Appendix) or proposed
by the student. In either case, the student must submit a to the instructor short, written proposal of the topic. For report writing requirements please consult a separate document.
- Examination option
3 written examinations given during the semester (1hr 15min each) 50%
Seminar participation 20%
Final Examination: 30%
Course topics
1. System integration
package definition
package functions
overview of system design
wirability
package families and
technology trends
2. Packaging materials
classification of packaging
materials
structure and bonding
mechanisms
diffusion processes
selected properties
alloys, phase diagrams
composite materials
3. Thermal management
heat transfer mechanisms
thermal resistance
contact resistance
cooling thechniques
air flow basics
thermally induced stresses
mechanical problems
4. Reliability
definitions
hazard rate
component reliability
temperature effects,
Arrhenius relations
systems reliability
elements of processing,
"popcorn" phenomenon
5. Electrical performance
electrical modeling,
circuit attributes
signal integrity,
perturbations ("noises")
issues in packaging of digital and mixed-signal circuits
signal propagation, delay
equations
performance metrics
6. Design optimization
performance metrics
multicriteria optimization
techniques
case study:
optimization of Printed Wire Board – selection
of optimum number of signal
layers in the board.
Appendix
ECE654
- Term topics
1. Overview of packaging technology trends
single chip packages
multi-chip packages
chip-size packages
novel materials and interconnect technologies.
2. Wirability relations for systems with
non-uniform components.
square components of various
dimensions
rectangular components
custom interconnect spacing
(mixed-signal systems).
3. Heat transfer in multi-layered
structures (PWB prototypes)
effects of channel wiring density
thermal vias
electrical vias
effects of ground and power plates
effects of mechanical stiffening
plates.
4. Thermally induced stresses in PWB
structures
plated through holes
interaction between channel wires and
substrate
interaction between isolating and
layers and metal plates
effects of structure imperfections.
5. Attributes of mixed-signal circuits
important for packaging design
summary of digital circuits attributes
summary of analog circuits attributes
attributes of mixed-signal circuits
routing of interconnects (power,
ground, clock, signals).
6. Signal integrity in mixed-signal
circuits
elements of signal propagation
modeling criteria (single and multiple
conductors)
delay equations
timing requirements.
\
7. Multi-criteria optimization for
mixed-signal design
signal converter as an example of
hardware with conflicting metrics
survey of existing optimization
techniques
application to optimization of
selected Digital-to-Analog Converter structure.
8. Performance metrics for mixed-signal
circuits
static metrics: differential
nonlinearity error, integral nonlinearity error
dynamic metrics: spur-free dynamic
range, glitch energy
spectral metrics: distortion measure,
signal-to-noise ratio.
9. Role of package parasitics in
oscillator phase noise
oscillator modeling, sensitivity
functions
perturbation coupling mechanisms
effect of parasitics of ground and
power connections
substrate coupling
electromagnetic coupling.
10. Study of noise generation mechanisms
and role of packaging design
switching noise
electromagnetic coupling
substrate coupling
noise suppression techniques
role of power and ground connections.
11. Study of packaging of
Analog-to-Digital Converters for communication applications
circuits structures
basic circuit components: attributes
and requirements
signal wiring requirements
ground and power wiring
performance metrics.
References: will be available on request.